BondMaster Probes
Our bond testing probes feature a versatile variety of detection technologies, including pitch-catch, mechanical impedance analysis (MIA), and resonance probes, each type addressing a specific bond testing application. Compatible with the BondMaster 600 multimode bond tester, our bond testing probes—available in kits or individually—enable reliable and efficient detection of disbonding in honeycomb and laminate composites as well as metal-to-metal disbonds. Explore these product pages below to determine which probe type is ideal for your application.
Please note that product availability varies by region. Contact your local Olympus sales office for more information.
Pitch-Catch Probes
Pitch-Catch probes are ideal to detect skin-to-core disbond in composite honeycomb. The broadband probe crystals allow scanning over a wide range of composite thicknesses.
Mechanical Impedance Analysis (MIA) Probes
Mechanical Impedance Analysis probes are best to detect smaller skin-to-core disbond on composite honeycomb. They are also a great tool to identify repaired (potted) areas.
Resonance Probes
Resonance method is ideal to detect delamination in composite laminates or inspect metal-to-metal bonding. Resonance probes come in various frequencies to accommodate the wide range of composite thicknesses and ply structure found in the industry.
BondMaster Probe Kits
BondMaster probe kits feature common kits approved in various procedures and work instructions.
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