粘接检测

Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection. Some of the primary applications include the location, identification and sizing of dis-bonds, delamination, and repair (putty) areas of honeycomb composite and composite laminates in aircraft structures(wings and flaps), high-performance racing vehicles, and boat hulls.

BondMaster 600

The portable BondMaster 600 delivers a powerful combination of multimode bond testing software and highly advanced digital electronics for the nondestructive inspection of honeycomb and laminate composites and metal-to-metal bonds.

OmniScan MX ECA/ECT

The Bond Testing C-Scan inspection solution is based on the OmniScan MX with ECT or ECA modules. This innovative solution increases the probability of detection of the pitch-catch bond testing method, as it produces live amplitude or phase C-scan images with up to 8 frequencies.

35RDC

The 35RDC is a simple Go/No-Go ultrasonic gage designed to detect subsurface defects caused by impact damage on aircraft composite structures. Features a backlit LCD that displays the word GOOD if no subsurface damage is found or the word BAD when it detects subsurface damage.

BondMaster Probes

BondMaster probes include a wide variety of versatile probes such as pitch-catch, MIA (mechanical impedance analysis), and resonance probes.