We used novel manufacturing technology to create objective lenses with simultaneously improved numerical aperture, working distance, and image flatness. Their high numerical aperture (NA) and 3 mm working distance improves field of view and image quality from the center to the edge, enabling greater throughput in automated semiconductor inspection. 20X and 50X brightfield lenses are available.
 

High Numerical Aperture and Long Working Distance MX Plan Semi-Apochromat Objectives – MXPLFLN

• Designed for brightfield, differential interference contrast (DIC), fluorescence, and simple polarized light observation methods
• Combines a high NA, long working distance, and image flatness 
• Available in 20X and 50X magnifications with a 3 mm working distance 

MXPLFLN50X
The MXPLFLN50X is our first 50X objective with a 0.8 numerical aperture and 3 mm working distance. Compared to a LMPLFLN100X objective, the field of view is four times greater thanks to the 0.8 NA at 50X magnification.

MXPLFLN20X
The MXPLFLN20X is our first 20X objective with a 0.6 numerical aperture and 3 mm working distance. Its high NA and high image flatness produces homogenous images that are ideal for stitching.