During bond testing inspections, the pitch-catch probe produces flexural plate waves and compression waves, and compares changes in the signal amplitude between the probe’s transmitter and receiver as it passes over the inspected part, detecting disbonds on both the near and far side. The BondMaster® 600 offers three Pitch-Catch mode options: RF (fixed frequency waveform), Impulse (legacy view featuring an envelope filter), or Swept (sweeping through a selected frequency range).

The Pitch-Catch menus of the BondMaster 600 have been optimized to provide fast access to the parameters that are adjusted most frequently during calibration and inspection. The real-time readings provide instantaneous information on the signal amplitude or phase, enabling you to interpret flaws more easily. The new Auto Gate mode automatically detects the best “gate” position based on the RF or impulse signal, reducing operator error and maximizing the results.

OEM Friendly: New Frequency Tracking Tool for Procedure Development

The BondMaster 600 Pitch-Catch Swept mode not only features improved signal quality, but also has a new “Spectrum” representation. This new view displays the live amplitude and phase of the signal compared to the frequency range. Two new frequency markers (called frequency tracking) allow you to observe the behavior of two specific frequencies so that you can choose the best detection parameters for a specific application. This new tool is ideal for developing procedures or new applications.

Easy Inspection of Metal-to-Metal Bonds and Laminate Composites

Resonance mode measures the changes in phase and amplitude of the propagating/standing wave within the probe. Resonance probes are narrow bandwidth contact transducers, and the changes in probe crystal impedance is represented in the X-Y display of the BondMaster® 600.

Resonance mode is a very simple and reliable way to detect delamination. Often, the depth of delamination can be estimated from signal phase rotation. Resonance mode on the BondMaster 600 is remarkably easy to operate, due in large part to its factory presets for laminate composite and metal-to-metal disbond applications.

Simplified Calibration through an Optimized Interface

Calibration of Resonance mode on the BondMaster 600 has been simplified to a minimum number of steps. First the optimum operating frequency for the probe is selected through the single-step calibration menu, and then the streamlined interface of the BondMaster 600 and the ability to calibrate from frozen signals make the final calibration quick and simple.

Once calibrated, the improved signal reference and reference dot system of the BondMaster 600 enables you to easily track critical signals on the display during inspection. Moreover, its reference points system is so flexible that you can fine-tune the calibration without having to rerecord the points.

The bond testing mechanical impedance analysis (MIA) method measures the mechanical impedance, or stiffness, of a material. MIA probes emit a fixed, audible frequency. Changes in material stiffness are indicated as signal amplitude and phase changes in X-Y view of the BondMaster® 600.

The small probe tip used with MIA, coupled with the high-performance electronics of the BondMaster 600, make detecting very small disbonds in honeycomb composite much easier than with other methods. Moreover, the extended MIA frequency range of the BondMaster 600 (2 kHz to 50 kHz) obtains maximum results, even for far side disbonds.

The BondMaster 600 features a simple MIA calibration wizard that guides you in selecting the best possible frequency for detecting smaller and otherwise hard-to-find defects in honeycomb composite.

Identifying repaired areas on aircraft rudders or fuselage can be a challenge, especially when they are painted. With certain inspection methods, such as thermography, repairs can generate false indications. However, MIA mode can resolve this problem. Because the repaired area is generally stiffer, its mechanical impedance contrasts well with good areas as well as with disbonds.

The improved MIA method offered by the BondMaster 600 allows you to identify repaired areas with ease, through a simple phase analysis of the MIA signal in the X-Y view.