Microscope Solutions for
Semiconductor Manufacturing
Die Bonding
Mount the IC chips onto designated locations on lead frames.
Checking for Defects Caused from Die Bonding
A part of the die bonder sometimes hits and scratches the surface of the IC chip. To fix the issue, the cause of the scratches must be identified using detailed inspections.
Our Solution
Our BX and MX series microscopes can observe defects on IC chips with high magnification.
BX series metallurgical microscope | MX series semiconductor microscope | IC chip after die bonding |
Application Notes
Explore related applications:
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BX series metallurgical microscope Request a Quote | MX series semiconductor microscope Request a Quote |
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