Evident LogoOlympus Logo

Microscope Solutions for
Semiconductor Manufacturing

Electrical Test

Check if the wafer runs correctly with an electronics tester called a prober.

Measuring Probe Mark Dimensions

During the electrical test of IC chips, the prober’s testing pin scratches the chips' aluminum pads. If the scratch mark is large, the electrical conductivity conditions on the aluminum pads will decay and affect the wire bonding process. As a result, the dimensions of the scratch marks must be measured.

Our Solution

Our DSX1000 digital microscope can capture 3D images and provide 3D measurements, enabling you to measure the scratch mark’s depth and width.

DSX series digital microscope

DSX series digital microscope

Probers

Probers

Prove mark on an aluminum pad

Prove mark on an aluminum pad

Application Notes

Explore related applications:

Circuit Pattern Inspection on Wafer Samples
Circuit Pattern Inspection on Wafer Samples Read More
Au Area Ratio Measurement for Bonded Surfaces after Bump Abruption
Au Area Ratio Measurement for Bonded Surfaces after Bump Abruption Read More
Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope
Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope Read More
Not available in your country.
Not available in your country.
Sorry, this page is not available in your country