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Microscope Solutions for
Semiconductor Manufacturing

Packaging

Package IC chips using epoxy resin.

Inspecting the Packaging appearance

Inspecting the appearance of packaging to check for defects of resin and pins is required. A microscope with intuitive operation is needed for this process.

Our Solution

Our SZ series stereo microscope combines ease of use with deep depth of field for seamless observation of the entire sample.

SZ series stereo microscope

SZ series stereo microscope

Packaging appearance

Packaging appearance

Application Notes

Explore related applications:

Sectioning Analysis for Ball Grid Array
Sectioning Analysis for Ball Grid Array (BGA) Surface Mounting of Semiconductor Package using the Olympus OLS5000 Laser Confocal Microscope Read More
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