Observation and Analysis Tools

• Leading-Edge Analysis Tools
• Advanced Designed to Support Cleanroom Conformity

Leading-Edge Analysis Tools

The MX63 series’ versatile observation capabilities provide clear, sharp images so users can reliably detect defects in their samples. New illumination techniques and image acquisition options within PRECiV image analysis software give users more choices for evaluating their samples and documenting their findings.

The Invisible Becomes Visible: MIX Observation and acquisition

MIX observation technology produces unique observation images by combining darkfield with another observation method, such as brightfield, fluorescence, or polarization. MIX observation enables users to view defects that are difficult to see with conventional microscopes. The circular LED illuminator used for darkfield observation has a directional darkfield function where only one quadrant is illuminated at a given time. This reduces a sample’s halation and is useful for visualizing a sample’s surface texture.

Structure on semiconductor wafer

Photoresist residue on a semiconductor wafer

Condenser

Easily Create Panoramic Images: Instant MIA

With multiple image alignment (MIA), users can stitch images together quickly and easily simply by moving the KY knobs on the manual stage—a motorized stage is not necessary. PRECiV software uses pattern recognition to generate a panoramic image, giving users a wider field of view.

Instant MIA image of a coin

Create all-in-focus images: EFI

The Extended Focus Imaging (EFI) function within PRECiV captures images of samples whose height extends beyond the depth of focus of the objective and stacks them together to create one image that is all in focus. EFI can be executed with either a manual or motorized Z-axis and creates a height map for easy structure visualization. It is also possible to construct an EFI image while offline within Stream Desktop.

Stud bump on an IC chip

Capture Both Bright and Dark Areas Using HDR

Using advanced image processing, high dynamic range (HDR) adjusts for differences in brightness within an image to reduce glare. HDR improves the visual quality of digital images thereby helping to generate professional-looking reports.

From Basic Measurement to Advanced Analysis

Measurement is essential to quality and process control and inspection. With this in mind, even the entry-level PRECiV software package includes a full menu of interactive measurement functions, with all measurement results saved with image files for further documentation. In addition, the PRECiV Materials Solution offers an intuitive, workflow-oriented interface for complex image analysis. At the click of a button, image analysis tasks can be executed quickly and precisely. With a significant reduction in processing time for repeated tasks, operators can concentrate on the inspection at hand.

> Learn more about PRECiV software

Efficient Report Creation

Creating a report can often take longer than capturing the image and taking the measurements. PRECiV software provides intuitive report creation to repeatedly produce smart and sophisticated reports based on pre-defined templates. Editing is simple and reports can be exported to Microsoft Word or PowerPoint software. In addition, PRECiV software’s reporting function enables digital zooming and magnification on acquired images. Report files are a reasonable size for easier data exchange by email.

> Learn more about PRECiV software

Advanced Designed to Support Cleanroom Conformity

The MX63 series is designed to work in a cleanroom and has features that help minimize the risk of contaminating or damaging samples. The system has an ergonomic design that helps keep users comfortable, even during prolonged use. The MX63 series complies with international specifications and standards, including SEMI S2/S8, CE, and UL.

Optional Wafer Loader Integration ― AL120 System* 

An optional wafer loader can be attached to MX63 series to safely transfer both silicon and compound semiconductor wafers from a cassette to the microscope stage without using tweezers or wands. Renowned performance and reliability enable safe, efficient front and back macro inspections while the loader helps improve productivity in the laboratory.

MX63 combined with the AL120 wafer loader (200 mm version)

* AL120 is not available in EMEA.

Fast, Clean Inspections

The MX63 series delivers contamination-free wafer inspections. All motorized components are housed in a shielded structure, and antistatic processing is applied to the microscope frame, tubes, breath shield, and other parts. The rotation speed of the motorized nosepieces is faster and safer than manual nosepieces, decreasing the time between inspections while keeping the operator's hands below the wafer, reducing potential contamination.

System Design Achieving Efficient Observations

The XY stage is capable of both coarse and fine stage movements thanks to the combination of a built-in clutch and the XY knobs. The stage helps make observations efficient, even for large samples, such as 300 mm wafers.
The tilting observation tube’s extensive range enables operators to sit at the microscope in a comfortable posture.

Accepts All Wafer Sizes

Intuitive Microscope Controls: Comfortable and Easy to Use

The microscope’s settings are simple to operate, making it easier for users to make adjustments and reproduce system settings.

Find the Focus Quickly: Focus Aid

Inserting a focus aid in the optical path allows easy and accurate focusing on low-contrast samples, such as bare wafers.

Left image: The grid indicates the image is out of focus. / Middle images: The grid assists focusing. / Right image: An in-focus image can be easily obtained. 

Easily Restore Microscope Settings: Coded Hardware

Coded functions integrate the MX63 series’ hardware settings with PRECiV image analysis software. The observation method, illumination intensity, and magnification are automatically recorded by the software and stored with the associated images. Since the settings can easily be reproduced, any operator can conduct the same quality inspections with minimal training.

Ergonomic Controls for Quicker, More Comfortable Operation

The controls for changing the objective and adjusting the aperture stop are positioned low and in the front of the microscope so users don’t have to let go of the focusing knobs or move their head away from the eyepieces during use.

Faster Observations via the Light Intensity Manager and Automatic Aperture Control

In normal microscopes, users need to adjust the light intensity and aperture for every observation. The MX63 series enables users to set up the light intensity and aperture conditions for different magnifications and observation methods. These settings can be easily recalled, helping users save time and maintain optimal image quality.

Light Intensity Manger

Automatic Aperture Control

Fully Customizable

The MX63 series is designed to enable the customer to choose a variety of optical components to suit individual inspections and application needs. The system can utilize all observation methods. Users can also select from a variety of PRECiV image analysis packages to suit individual image acquisition and analysis needs.

Two Systems Accommodate Diverse Sample Sizes 

The MX63 system can accommodate wafers up to 200 mm while the MX63L system can handle wafers up to 300 mm with the same small footprint as the MX63 system. The modular design makes it easy to customize the microscope for your specific requirements

IR compatibility

Infrared observation can be conducted with the IR objective lenses, which enable the operators to nondestructively inspect the inside of IC chips packed and mounted on a PCB, utilizing the characteristics of silicon that transmit infrared light. 5X to 100X IR objectives are available with chromatic aberration correction from visible light wavelengths through the near infrared. Especially with an objective lens of 20X or more, the aberration caused by the silicon layer covering the observation object can be corrected by the correction collar to obtain a clear image.

The MX63 series is used in a range of reflected light microscopy applications. These applications are an example of some of the ways the system is used for industrial inspections.

IR image of an electrode section

Infrared (IR) is used to look for defects inside IC chips and other devices made with silicon on glass.

Film
(Left: Brightfield / Right: Polarized light)

Polarized light is used to reveal a material’s texture and the condition of crystals. It is suitable for inspections of wafer and LCD structures.

A hard disk
(Left: Brightfield / Right: DIC)

Differential interference contrast (DIC) is used to help view samples with minute height differences. It is ideal for inspections of samples having very minute height differences such as magnetic heads, hard-disk media, and polished wafers.

IC pattern on a semiconductor wafer
(Left: Darkfield / Right: MIX (Brightfield + Darkfield))

Darkfield is used for detecting minute scratches or flaws on a sample or inspecting samples with mirrored surfaces, such as wafers. MIX illumination enables users to view both patterns and colors.

Photoresist residue on a semiconductor wafer
(Left: Fluorescence / Right: MIX (Fluorescence + Darkfield))

Fluorescence is used for samples that emit light when illuminated with a specially designed filter cube. This is used to detect contamination and photoresist residue. MIX illumination enables the observation of both the photoresist residue and IC pattern. 

An LCD color filter
(Left: Transmitted Light / Right: MIX (Transmitted Light + Brightfield))

This observation technique is suitable for transparent samples such as LCDs, plastics, and glass materials.  MIX illumination enables the observation of both the filter color and circuit pattern.