BondMaster 1000 型复合材料检测仪

The BondMasterTM 1000+ is a versatile, full multi-mode instrument, with Resonance, MIA (Mechanical Impedance Analysis), and Pitch/Catch mode with the addition of the new RF display mode. The BondMasterTM 1000+ is the only true multi-mode composite test instrument on the market. This offers the user the ability to select the method best suited to inspect the wide variety of composite materials used. Its high performance, lightweight, and rugged durability make it the choice for applications in the manufacturing, maintenance and repair of composite materials.
Weighing less than 4 lbs. (1.8 kg) with customer-interchangeable displays, the BondMaster 1000+ offers users the highest resolution available today. The availability of a color LCD or monochrome LCD for indoor or bright outdoor conditions or a Hi-Brite Electroluminescent (EL) display for normal to dark conditions provides the ultimate in flexibility and convenience. Its rugged, well designed housing, uncomplicated front panel, SmartKnobTM and built in PowerLinkTM technology, make it a truly revolutionary user-friendly hand held portable ultrasonic flaw detector.
The BondMaster 1000+ uses PowerLinkTM technology to configure the instrument to the technology in use when the sensor is connected. Built-in calibration modes assist the user in optimizing the test parameters. A variety of sensors in each of the test technologies is available.
The instrument uses a computer style lithium ion battery.

Features

• Single Li-Ion battery
• Lightweight, less than 4lbs. (1.8 Kg)
• Customer interchangeable displays:
- Hi-Brite Electroluminescent
- Monochrome Liquid Crystal
- Color Liquid Crystal
• VGA Output
• RS-232 output for printer or computer interface
• Alarm outputs
• Program storage
• Trace storage
• PowerLinkTM Technology - automatic probe recognition and instrument set-up
• Full Multi-Mode Capability:
- Pitch / Catch (Swept, Impulse, RF)
- Resonance
- MIA - Mechanical Impedance Analysis
• High voltage Pitch / Catch probes available