Get reliable data quickly
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity.
![]() | 1. Precise imagingCapture the shape of any surface. | |
2. FastGet reliable data four times faster than our previous model. | ||
3. Easy to operateJust place your sample and press the Start button. | ||
4. Longer working distance for larger samplesMeasure samples that are up to 210 mm tall. |
With the capability to make accurate 3D measurements on a wide range of sample types, the system delivers reliable data for quality assurance and process control.
| The 405 nm violet laser and dedicated high-NA objectives make it possible to capture fine patterns and defects that conventional optical microscopes, white-light interferometers, or red laser-based microscopes are unable to detect. | |
Red type (658 nm: 0.26 μm line & space) | Violet type (405 nm: 0.12 μm line & space) | |
Dedicated LEXT objectives can accurately measure peripheral areas that would otherwise get distorted. |
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![]() | New MEMS scanner performs accurate X-Y scanning with low scan trace distortion and minimal optical aberrations. |
| The 4K scan technology scans 4,096 pixels — four times more than our previous model — in the X-axis direction. |
| Because conventional laser microscopes use standard image processing techniques such as smoothing to eliminate noise, they sometimes lose accurately measured fine height irregularities along with the noise. |
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The information on this page, including the accuracy guarantee, is based on conditions set by Olympus.
The microscope's scanning algorithm delivers improved data quality and greater speed to reduce the scan time and streamline your workflow, resulting in better productivity. |
VLSI Standard 80 nm height sample (MPLFLN10XLEXT) | The OLS5000 microscope incorporates a PEAK algorithm for 3D data construction. This algorithm provides highly accurate data from low to high magnifications and reduces the data acquisition time. |
When measuring the shape of steps on a sample containing near-vertical planes, such as an electronic component or MEMS, the data acquisition time can be reduced by limiting the Z-direction scanning range.
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The information on this page, including the accuracy guarantee, is based on conditions set by Olympus.
| The system features automatic data capture, so difficult setting adjustments are no longer necessary. Even users with minimal training can still obtain accurate results. |
| The simple analysis function measures the step, line width, surface roughness, area, and volume only in the specified measurement areas. The causes of variance in the measurement results, such as the edge position and the threshold of the reference planes in volume analysis, are automatically detected so that the measurement results are stable and not affected by the operator’s skill level. |
| Measurement of the step height difference and distance between two specified regions. |
| Measurement of the difference in angle between two specified regions. |
| Measurement of the area/volume in the specified region; the reference planes are detected automatically, so no threshold setting is necessary. |
| Measurement of the surface roughness in the specified region. |
| Measurement of the width by automatically detecting edges in the specified region. |
| Measurement of R and the height from the reference plane based on the automatic recognition of a circular shape in the specified region. |
| Smart Judge processing automatically eliminates measurement noise without compromising data accuracy, while Smart Leveling detects the main horizontal plane (reference plane) at the zero height position. Activate both with a single click. |
All of the operations and procedures included in a report can be saved as a template.
Using this template when repeating the same measurements makes it possible to obtain an analysis report on the next set of data that applies the same procedures.
The ability to specify processing operations and measuring points without the operator’s intervention enables fast, precise analysis with minimal variance.
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Conduct the inspection and take measurements. | Output the report and save the template. | During the next acquisition, open the saved template. | Instantly output a report based on the template. |
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The information on this page, including the accuracy guarantee, is based on conditions set by Olympus.
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The extension frame for the OLS5000 microscope accommodates samples with a height of up to 210 mm, while the ultra-long working distance objective facilitates measurement of concavities as deep as 25 mm.
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Connecting rod | Tool | Piston head | |
Olympus offers a line of 10x to 100x objectives capable of reducing aberrations at a scale of 405 nm. Low power and long working distance objectives are also available in this series. The measurement performance of all dedicated LEXT objectives is guaranteed, so you can select the one best suited to the sample you're observing.
Standard roughness sample 528 by Rubert & Co., Ltd. (Pt = 1.5 μm)
General-purpose lens (50x) |
LEXT-dedicated lens (50x) |
| Our line of dedicated LEXT objectives include a 10x objective and long working distance objectives, enhancing the microscope's measurement performance. |
The information on this page, including the accuracy guarantee, is based on conditions set by Olympus.
Inner texture / Area roughness measurement (MPLAPON20XLEXT / 3 x 3 stitched) | Fuel injector nozzle (replica) / Area roughness measurement (LMPLFLN50XLEXT) |
Piston ring / Area roughness measurement (MPLAPON50XLEXT) | Bearing ball / Profile measurement (MPLAPO50XLEXT) |
Corrosion on stainless steel / Height measurement (MPLAPON20XLEXT / 3 x 3 stitched) | Copper plate / Area roughness measurement (MPLAPON50XLEXT) |
Diffusion plate / Profile measurement (MPLAPON50XLEXT / 3 x 3 stitched) | Sponge / Profile measurement (MPLAPON20XLEXT / 3 x 3 stitched) |
Ni bump / Height measurement (MPLAPON20XLEXT) | MEMS ultrasonic transducer (MPLAPON50XLEXT) |
Photoresist / Height measurement (MPLAPON100XLEXT) | Bonding wire (MPLAPON100XLEXT) |
Micro needle / Profile measurement (MPLAPON50XLEXT / 6 x 6 stitched) |
Skin (replica) / Area roughness measurement (MPLAPON20XLEXT / 5 x 5 stitched)
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Grind stone / Profile measurement (MPLAPON20XLEXT) | Acceptance seat of ballpoint pen / Area roughness measurement (LMPLFLN20XLEXT) |
| Model | OLS5000-SAF | OLS5000-SMF | OLS5000-LAF | OLS5000-EAF | OLS5000-EMF | |
|---|---|---|---|---|---|---|
| Total magnification | 54x - 17,280x | |||||
| Field of view | 16um - 5,120um | |||||
| Measurement principle | Optical system |
Reflection-type confocal laser scanning laser microscope
Reflection-type confocal laser scanning laser-DIC microscope Color Color-DIC | ||||
| Measurement principle | Light receiving element |
Laser: Photomultiplier (2ch)
Color: CMOS color camera | ||||
| Height measurement | Display resolution | 0.5nm | ||||
| Height measurement | Dynamic range | 16 bits | ||||
| Height measurement | Repeatability σn-1*1 *2 *5 | 5X:0.45μm, 10X:0.1μm, 20X : 0.03μm, 50X : 0.012μm, 100X : 0.012μm | ||||
| Height measurement | Accuracy *1 *3 *5 | 0.15+L/100μm (L:Measuring length[μm]) | ||||
| Height measurement | Accuracy for stitched image *1 *3 *5 | 10X:5.0+L/100 μm, 20X or higher : 1.0+L/100 μm (L: Stitching length [μm]) | ||||
| Height measurement | Measurement noise (Sq noise) *1 *4 *5 | 1nm | ||||
| Width measurement | Display resolution | 1nm | ||||
| Width measurement | Repeatability 3σn-1 *1 *2 *5 | 5X : 0.4 μm, 10X : 0.2 μm, 20x : 0.05 μm, 50X : 0.04 μm, 100X : 0.02 μm | ||||
| Width measurement | Accuracy *1 *3 *5 | Measurement value +/- 1.5% | ||||
| Width measurement | Accuracy for stitched image *1 *3 *5 | 10X : 24+0.5L μm, 20X : 15+0.5L μm, 50X : 9+0.5L μm, 100X : 7+0.5L μm (L: Stitching length [mm]) | ||||
| Maximum number of measuring points in a single measurement | 4096 x 4096 pixel | |||||
| Maximum number of measuring points | 36 Mpixel | |||||
| XY stage configuration | Length measurement module | • | NA | NA | • | NA |
| XY stage configuration | Operating range | 100 x 100mm Motorized | 100 x 100mm Manual | 300 x 300 mm Motorized | 100 x 100mm Motorized | 100 x 100mm Manual |
| Maximum sample height | 100mm | 30mm | 37mm | 210mm | 140mm | |
| Laser light source | Wavelength | 405nm | ||||
| Laser light source | Maximum output | 0.95 mW | ||||
| Laser light source | Laser class | Class 2 (IEC60825-1:2007, IEC60825-1:2014) | ||||
| Color light source | White LED | |||||
| Electrical power | 240 W | 240 W | 278 W | 240 W | 240 W | |
| Mass | Microscope body | Approx. 31 kg | Approx. 32 kg | Approx. 50 kg | Approx. 43 kg | Approx. 44 kg |
| Mass | Control box | Approx. 12 kg | ||||
*1 Guaranteed when used in constant temperature and constant-temperature environment (temperature: 20˚C±1˚C, humidity: 50%±1%) specified in ISO554(1976), JIS Z-8703(1983).
*2 For 20x or higher, when measured with MPLAPON LEXT series objectives.
*3 When measured with dedicated LEXT objective.
*4 Typical value when measured with MPLAPON100XLEXT objective, and may differ from the guaranteed value.
*5 Guaranteed under Olympus Certificate System.
** The OS license of Window 10 has been certified for the microscope controller (PC) provided by olympus. Therefore, Microsoft's license terms are applied and you agree to the terms.Please refer to the following for Microsoft license terms.
https://www.microsoft.com/en-us/Useterms/Retail/Windows/10/UseTerms_Retail_Windows_10_japanese.htm
| Series | Model | Numerical Aperture(NA) | Working Distance(WD)(mm) |
|---|---|---|---|
| UIS2 objective lens | MPLFLN2.5x | 0.08 | 10.7 |
| MPLFLN5x | 0.15 | 20 | |
| LEXT dedicated objective lens (10X) | MPLFLN10xLEXT | 0.3 | 10.4 |
| LEXT dedicated objective lens (High performance type) | MPLAPON20xLEXT | 0.6 | 1 |
| MPLAPON50xLEXT | 0.95 | 0.35 | |
| MPLAPON100xLEXT | 0.95 | 0.35 | |
| LEXT dedicated objective lens (Long working distance type) | LMPLFLN20xLEXT | 0.45 | 6.5 |
| LMPLFLN50xLEXT | 0.6 | 5 | |
| LMPLFLN100xLEXT | 0.8 | 3.4 | |
| Super long working distance lens | SLMPLN20x | 0.25 | 25 |
| SLMPLN50x | 0.35 | 18 | |
| SLMPLN100x | 0.6 | 7.6 | |
| Long working distance for LCD lens | LCPLFLN20xLCD | 0.45 | 8.3-7.4 |
| LCPLFLN50xLCD | 0.7 | 3.0-2.2 | |
| LCPLFLN100xLCD | 0.85 | 1.2-0.9 |
| Standard software | OLS50-BSW | Data acquisition app |
|---|---|---|
| Analysis app (Simple analysis) | ||
| Motorized stage package application*1 | OLS50-S-MSP | |
| Advanced analysis application*2 | OLS50-S-AA | |
| Film thickness measurement application | OLS50-S-FT | |
| Auto edge measurement application | OLS50-S-ED | |
| Particle analysis application | OLS50-S-PA | |
| Multi-data analysis application | OLS50-S-MA | |
| Sphere/cylinder surface angle analysis application | OLS50-S-SA | |
*1 Including Auto-stitching data acquisition and Multi-area data acquisition functions.
*2 Including Profile analysis, Difference analysis, Step-height analysis, Surface analysis, Area/volume analysis, Line roughness analysis, Area roughness analysis and Histogram analysis.

OLS5000-SAF Setup Example
OLS5000-SAF
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OLS5000-EAF
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OLS5000-SMF
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OLS5000-EMF
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OLS5000-LAF
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